Copper Bonded Rod with Electrogrip BFC GEM

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Copper Bonded Rod with Electrogrip BFC GEM

Name: Copper Bonded Rod with Electrogrip BFC GEM
Brand: ELAPP POWER PRIVATE LIMITED
Price: 1000.00 INR
Availability: InStock

Price 1000.00 INR/ Piece

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MOQ : 1 Piece

Copper Bonded Rod with Electrogrip BFC GEM Specification

Feature
Corrosion Resistant, High Conductivity, Uniform Copper Bonding, Maintenance Free

Humidity %
0 to 100% (Suitable for all humidity conditions)

Operating Temperature
-10C to +70C

Shape
Cylindrical Rod

Mounting Type
Direct Earth Buried

Surface Finish
Electrolytic Copper Plating (Thickness: 100-250 microns)

Overheating Protection
Yes (Prevents Overheating with BFC Backfill)

IP Rating
IP68 (Underground Installation Suitable)

Connector Type
Copper Coupling/Brass Clamp

Efficiency
>95% Earthing Performance

Product Type
Copper Bonded Earth Rod with BFC GEM Compound

Application
Electrical Earthing, Lightning Protection, Industrial and Residential Earthing

Protection Level
Ensures Low Resistance Earthing System

Frequency (MHz)
DC/50-60 Hz Typical Power Frequency

Rated Voltage
Up to 66 kV System Voltage

Output Type
Direct Grounding/Earthing

Color
Copper Brown/Golden

Dimension (L*W*H)
Typical Rods: 17.2mm/25mm diameter x 1m, 2m, 3m length; BFC GEM: 25kg Pack

Weight
Approx. 7-15 kg (Varies with rod size)

Phase
Single Phase

Size
Diameter: 14.2mm to 25mm, Length: 1m to 3m

Material
High Tensile Low Carbon Steel core with 99.9% Pure Electrolytic Copper Bonding

No Of Poles
Single Rod

Connection Type
Threaded/Male-Female Coupler

Environmental Impact
Environment Friendly, Chemical Free GEM Compound

Packing Details
Earth Rod, Coupler Clamp, 25kg BFC GEM Packed Together

RoHS Compliance
Yes

Corrosion Resistance
High, Suitable for aggressive soil conditions

Service Life
>30 Years in Typical Soil Conditions

Electrical Conductivity
Extensive Copper Bonding ensures low earth resistance

Installation Method
Direct Driven by Hammer or Hydraulic Ram

Copper Bonding Thickness
100 to 250 microns as per UL 467/IEC 62561-2 Standards

BFC GEM Description
Back Fill Compound (BFC) is a conductive, moisture retaining earthing enhancement material supplied in 25kg bags

Ultimate Tensile Strength
Min 600 N/mm²

Copper Bonded Rod with Electrogrip BFC GEM Trade Information

Minimum Order Quantity
1 Piece

Supply Ability
100 Pieces Per Day

Delivery Time
1 Days

About Copper Bonded Rod with Electrogrip BFC GEM

Specification

Country of Origin	Made in India
Usage/Application	Maintenance Free Chemical Earthing
Length Of Rod	2 meters
Service Life	7-10 Years
Thickness	250 microns (coating)
Brand	Electrogrip
Material	Mild Steel
Diameter	16 mm

Advanced Corrosion Resistance and Longevity

With a uniform electrolytic copper bonding of 100-250 microns, these rods exhibit exceptional corrosion resistance, making them ideal for aggressive soil environments. The design promises a life span exceeding 30 years in typical ground conditions, ensuring minimized maintenance and reliable performance for various earthing systems.

Ultra-low Earth Resistance and High Efficiency

Extensive copper bonding and the use of Electrogrip BFC GEM (Back Fill Compound)-a moisture-retaining, conductive enhancer-ensure consistently low earth resistance. Suitable for both industrial and residential settings, this solution achieves over 95% earthing efficiency, safeguarding installations from electrical faults and lightning strikes.

Eco-friendly and Easy Installation

The BFC GEM compound is environmentally friendly, chemical-free, and safe for use around water sources and ecosystems. Installation is straightforward: rods are directly driven into the earth using a hammer or hydraulic ram, and BFC GEM is packed around them for enhanced conductivity. This method offers a maintenance-free and sustainable grounding system.

FAQ's of Copper Bonded Rod with Electrogrip BFC GEM:

Q: How is the Copper Bonded Rod with Electrogrip BFC GEM installed?

A: Installation involves directly driving the cylindrical copper bonded rod into the earth using a hammer or hydraulic ram. The 25kg BFC GEM Back Fill Compound is then packed around the rod to further enhance conductivity and earth contact, making the process straightforward and minimizing maintenance.

Q: What are the key benefits of using Electrogrip BFC GEM Back Fill Compound?

A: BFC GEM enhances the electrical performance of the earthing system by retaining moisture, reducing soil resistivity, and promoting optimal conductivity. Being environmentally friendly and chemical-free, it prevents soil contamination while delivering reliable low-resistance grounding.

Q: When should I choose copper bonded rods with BFC GEM for an earthing system?

A: This solution is ideal for aggressive or varied soil conditions, sites requiring high corrosion resistance, or where long-term maintenance-free operation is needed, such as industrial plants, data centers, and residential developments requiring robust protection against electrical faults and lightning.

Q: Where can the copper bonded earthing rods be used?

A: They are suitable for a wide variety of settings including industrial facilities, residential premises, substations, and lightning protection systems. The IP68 rating ensures suitability for underground installations, even in wet or highly humid conditions.

Q: What is the typical lifespan of the copper bonded rod with BFC GEM, and what affects it?

A: The system is engineered for a service life of over 30 years under typical soil conditions. Factors contributing to its longevity include the thick copper bonding (100-250 microns), high tensile steel core, and the protective properties of the BFC GEM, all of which provide resilient, corrosion-resistant operation.

Q: How does copper bonding thickness influence performance and reliability?

A: A copper bonding thickness of 100-250 microns ensures durable protection against corrosion, a stable and low-resistance connection to earth, and an extended operational life, even under harsh environmental and soil conditions.

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